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DX-532-48
厂家:Photonics Industries
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YLPN-100-25x100-1000-S
厂家:IPG Photonics
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慕尼黑 517-20
厂家:Coherent Inc.
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0785 L-13 A;785 nm火柴盒激光器
厂家:Integrated Optics
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GLK 32XX TS
厂家:LASOS Lasertechnik GmbH
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DIADEM IR-30
厂家:Spark Lasers
光电查为您提供94个产品。下载资料,获取报价,实现功能、价格及供应的优化选择。
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DX-532-48
技术: Q-Switched Laser, DPSS laser 功率: 48w 应用: Cutting, drilling, welding, scribing, marking, intra-marking, patterning, dielectric grooving, de-paneling, annealing, repair, Reel to reel on-the-fly Converting Process Micromachining, PCB/FPCB cutting, drilling, depaneling, Silicon Wafer Scribing and Singulation, Low-k dielectric grooving, Solar Cell Scribing and PERC processing, Via Hole Drilling, Laser Trepanning, Laser Percussion Drilling, Laser Lift-Off (LLO), Laser Debonding Systems, Semiconductor Microprocessing, LIDAR Systems Autonomous Systems, 3-D Scanning Systems, Airborne Laser Swath Mapping Systems, Laser Altimetry Systems 偏振比: >500:1 光束质量因子(M2): < 1.1Photonics Industries的DX-532-48是一款波长为532 nm、功率为48W、脉冲能量为0.6 MJ、工作温度为15至35摄氏度、存储温度为-10至40摄氏度的激光器。有关DX-532-48的更多详细信息,请联系我们。
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SN 1064-70
功率: 70 W 应用: Solar cell processing (PERC, CIGS, etc.), Glass, sapphire, ceramic cutting, scribing, and ablative drilling, Low K wafers and LED substrates scribing/dicing, Via hole drilling, PCB processing, ITO patterning/FPD processing, Intraglass/subsurface marking, LIDAR, Bathymetry CZMIL, Cryosphere and Biomass Measurements 光束质量因子(M2): <1.3 横模: TEMooPhotonics Industries的Sn 1064-70是一款波长为1064 nm、功率为70 W、工作温度为15至30摄氏度的激光器。有关Sn 1064-70的更多详细信息,请联系我们。
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DMX200-532
技术: DPSS Laser, Solid State Laser 功率: 200 W 应用: Particle Image Velicometry (PIV), Annealing or “Bleaching” (changing of material properties without material removal), Pumping Ti:Sa Ultrafast Amplifier Systems, High Power or High Pulse Energy Drilling or Cutting of Hard Materials 偏振比: 100:1 增益介质类型: Solid State (Crystal / Glass)来自Photonics Industries的DMX200-532是一种波长为532 nm、功率为200 W、脉冲能量为20 MJ、工作温度为15至30摄氏度的激光器。DMX200-532的更多详细信息可在下面查看。
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FS1-1030-50
功率: 50 W 应用: Ultrafast high precision cutting, drilling, welding, scribing, marking, intra-marking, patterning, depaneling, repair, Flat Panel Display Repair, LCD/LED/OLED Repair, Hydrophobic Material Manufacturing, Hydrophilic Material Manufacturing, Ultrafast Laser Assisted Etching (ULAE) Systems, Complex 3D Surface Micro-structuring, Terahertz (THz) Generation, High Harmonic Generation (HHG), X-Ray Generation, OPO Amplifier Systems, Laser Particle Accelerator Systems, Angle/Time-resolved Photoemission Spectroscopy Systems, Femtosecond-stimulated Raman Spectroscopy (FSRS) Systems, Multi-photon Fluorescence Microscopy Systems 光束质量因子(M2): < 1.2 横模: TEM00Photonics Industries的FS1-1030-50是一款波长为1030 nm、功率为50 W、脉冲能量为50µJ、工作温度为15至30摄氏度的激光器。有关FS1-1030-50的更多详细信息,请联系我们。
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RX 355-20
功率: 20 W 应用: Cutting/scribing display glass and functional foils for FPDs, Glass and sapphire cutting and drilling, Semiconductor scribing and dicing, PCB processing, Solar cell scribing and drilling, LED scribing, dicing and patterning, Metal and Ceramic cutting, drilling and marking, Medical device cutting, drilling and marking, Glass Reinforced Plastic & Carbon Fiber Cutting, Ink-Jet Nozzle Drilling, Printing & Embossing Tools, Nanotexturing 光束质量因子(M2): <1.2 横模: TEMooPhotonics Industries的RX 355-20是一款波长为355 nm、功率为20 W、工作温度为15至30摄氏度的激光器。有关RX 355-20的更多详细信息,请联系我们。
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DX-355-LP
技术: Q-Switched Laser, DPSS laser 功率: 4 to 16 W 应用: Cutting, drilling, welding, scribing, grooving, marking, intra-marking, patterning, de-paneling, annealing, Selective Laser Annealing, Ohmic Contact Formation Systems, Laser Grooving Systems, Laser Wafer Singulation Systems, Semiconductor Microprocessing, Laser Thermal Processing (LTP) Systems, Annealing, Laser Heat-tempering Metal Marking, Laser Discoloration & Bleaching Plastic Marking 偏振比: 100:1 光束质量因子(M2): < 1.2Photonics Industries的DX-355-LP是一款纳秒激光器,工作波长为355 nm.它的平均功率高达16 W,功率稳定性为±2%RMS.该激光器的脉冲宽度为95-250ns,单次脉冲重复频率为200kHz,脉冲间稳定度小于1.5%RMS.它产生直径为0.8mm的光束,光束质量因子M2优于1.2,光束指向稳定性小于25μrad.该激光器可通过RS232或以太网接口进行控制。DX-355-LP具有可靠、低COO、非耗材设计,可产生腔内谐波UV和绿光,不会对谐波晶体造成破坏性索引。它需要100-240 V的交流电源,32 V的直流电源,功耗高达400 W.该激光器采用尺寸为22.5 X 7.5 X 3.75英寸的模块,适用于切割、钻孔、焊接、划线、开槽、打标、内部打标、图案化、去镶板、退火、选择性激光退火、欧姆接触形成系统、激光开槽系统、激光、晶圆单片化系统、半导体微加工、激光热处理(LTP)系统、退火、激光热回火金属标记、激光脱色和漂白塑料标记应用。
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SN 1064-30
功率: 30 W 应用: Solar cell processing (PERC, CIGS, etc.), Glass, sapphire, ceramic cutting, scribing, and ablative drilling, Low K wafers and LED substrates scribing/dicing, Via hole drilling, PCB processing, ITO patterning/FPD processing, Intraglass/subsurface marking, LIDAR, Bathymetry CZMIL, Cryosphere and Biomass Measurements 光束质量因子(M2): <1.3 横模: TEMooPhotonics Industries的Sn 1064-30是一款波长为1064 nm、功率为30 W、工作温度为15至30摄氏度的激光器。有关Sn 1064-30的更多详细信息,请联系我们。
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DMX60-527-DH
功率: 180 W来自Photonics Industries的DMX60-527-DH是一种波长为527 nm、功率为180 W、脉冲能量为120 MJ、工作温度为15至30摄氏度的激光器。DMX60-527-DH的更多详细信息可在下面查看。
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RX系列低功率皮秒激光器
平均值功率: 3-30W 脉冲间稳定性: 1% 冷却: Water-to-Water, Water-to-AirRX系列激光器拥有专利的脉冲选择功能,在全球范围内售出了一千多台皮秒激光器,与其前身RGH系列相比,RX系列激光器采用了全新的革命性封装,具有更小的外形尺寸和更高的性能。RX现在在较简单、较紧凑的AIO(一体化)平台上提供10W至100W的红外、5W至70W的绿光和3W至45W的紫外输出功率,从单发到2MHz(可选到8MHz)。专有技术使RX系列激光器能够提供两倍于同类竞争对手系统的脉冲能量。这样的高脉冲能量允许通过空间缩放来优化处理效率,因为光束可以被分割多次以同时馈送多个工作站,从而产生较低的拥有成本(CoO)。Photonics Industries的皮秒激光器已经证明了其在较苛刻的工业制造环境中的稳定性,应用范围包括金属雕刻/标记、LED切割、薄膜去除、小特征结构、玻璃、蓝宝石和陶瓷切割、钻孔等。到3D激光雷达。
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DX-532-LP
技术: Q-Switched Laser, DPSS laser 功率: 25 to 35 W 应用: Cutting, drilling, welding, scribing, grooving, marking, intra-marking, patterning, de-paneling, annealing, Selective Laser Annealing, Ohmic Contact Formation Systems, Laser Grooving Systems, Laser Wafer Singulation Systems, Semiconductor Microprocessing, Laser Thermal Processing (LTP) Systems, Annealing, Laser Heattempering Metal Marking, Laser Discoloration & Bleaching Plastic Marking 偏振比: 100:1 光束质量因子(M2): < 1.2Photonics Industries的DX-532-LP是一款波长为532 nm、功率为25至35 W、工作温度为15至35摄氏度、存储温度为-10至40摄氏度的激光器。有关DX-532-LP的更多详细信息,请联系我们。
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DMX20-527
技术: DPSS Laser, Solid State Laser 功率: 30 W 应用: Particle Image Velicometry (PIV), Annealing or “Bleaching” (changing of material properties without material removal), Pumping Ti:Sa Ultrafast Amplifier Systems, High Power or High Pulse Energy Drilling or Cutting of Hard Materials 偏振比: 100:1 增益介质类型: Solid State (Crystal / Glass)来自Photonics Industries的DMX20-527是一种波长为527 nm、功率为30 W、脉冲能量为20 MJ、工作温度为15至30摄氏度的激光器。DMX20-527的更多详细信息可在下面查看。
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DMX60-527
技术: DPSS Laser, Solid State Laser 功率: 90 W 应用: Particle Image Velicometry (PIV), Annealing or “Bleaching” (changing of material properties without material removal), Pumping Ti:Sa Ultrafast Amplifier Systems, High Power or High Pulse Energy Drilling or Cutting of Hard Materials 偏振比: 100:1 增益介质类型: Solid State (Crystal / Glass)来自Photonics Industries的DMX60-527是一种波长为527 nm、功率为90 W、脉冲能量为60 MJ、工作温度为15至30摄氏度的激光器。有关DMX60-527的更多详细信息,请联系我们。
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DMX20-527-DH
功率: 60 W来自Photonics Industries的DMX20-527-DH是一款波长为527 nm、功率为60 W、脉冲能量为40 MJ、工作温度为15至30摄氏度的激光器。DMX20-527-DH的更多详细信息可在下面查看。
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DMX60-532-DH
功率: 120 W来自Photonics Industries的DMX60-532-DH是一种波长为532 nm、功率为120 W、脉冲能量为12 MJ、工作温度为15至30摄氏度的激光器。DMX60-532-DH的更多详细信息可在下面查看。
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DMX50-527
技术: DPSS Laser, Solid State Laser 功率: 75 W 应用: Particle Image Velicometry (PIV), Annealing or “Bleaching” (changing of material properties without material removal), Pumping Ti:Sa Ultrafast Amplifier Systems, High Power or High Pulse Energy Drilling or Cutting of Hard Materials 偏振比: 100:1 增益介质类型: Solid State (Crystal / Glass)来自Photonics Industries的DMX50-527是一种波长为527 nm、功率为75 W、脉冲能量为50 MJ、工作温度为15至30摄氏度的激光器。DMX50-527的更多详细信息可在下面查看。
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DMX30-527
技术: DPSS Laser, Solid State Laser 功率: 45 W 应用: Particle Image Velicometry (PIV), Annealing or “Bleaching” (changing of material properties without material removal), Pumping Ti:Sa Ultrafast Amplifier Systems, High Power or High Pulse Energy Drilling or Cutting of Hard Materials 偏振比: 100:1 增益介质类型: Solid State (Crystal / Glass)来自Photonics Industries的DMX30-527是一种波长为527 nm、功率为45 W、脉冲能量为30 MJ、工作温度为15至30摄氏度的激光器。DMX30-527的更多详细信息可在下面查看。
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DMX50-527-DH
功率: 150 W来自Photonics Industries的DMX50-527-DH是一种波长为527 nm、功率为150 W、脉冲能量为100 MJ、工作温度为15至30摄氏度的激光器。DMX50-527-DH的更多详细信息可在下面查看。
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DX-355-10
技术: DPSS laser 功率: 8 to 10 W 应用: Cutting, drilling, welding, scribing, marking, intra-marking, patterning, dielectric grooving, annealing, repair, Laser Marking on-the-fly (MOTF), Laser Etching, Laser Patterning, Short Pulse Marking, High Precision Marking, DPSS Laser Marking Systems, Flat Panel Display Repair, Solar Cell Laser Structuring, P1 & P3 Solar Cell Processing, Stereolithography (SLA), Rapid Prototyping 3D Printing, UV Laser 3D Printing, Mass Spectrometry Systems, MALDI, LIDAR, Autonomous Systems, 3-D Scanning Systems, Thin Display Cutting & Drilling, Thin Film Transistor (TFT) Drilling 偏振比: 100:1 光束质量因子(M2): < 1.1Photonics Industries的DX-355-10是一款波长为355 nm、功率为8至10 W、脉冲能量为200µJ、工作温度为10至30摄氏度、存储温度为-10至40摄氏度的激光器。有关DX-355-10的更多详细信息,请联系我们。
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DX-355-20
技术: Q-Switched Laser, DPSS laser 功率: 10 to 20 W 应用: Cutting, drilling, welding, scribing, marking, intra-marking, patterning, dielectric grooving, de-paneling, annealing, repair, Reel to reel on-the-fly Converting Process Micromachining, PCB/FPCB cutting, drilling, depaneling, Silicon Wafer Scribing and Singulation, Low-k dielectric grooving, Solar Cell Scribing and PERC processing, Via Hole Drilling, Laser Trepanning, Laser Percussion Drilling, Laser Lift-Off (LLO), Laser Debonding Systems, Semiconductor Microprocessing, LIDAR Systems Autonomous Systems, 3-D Scanning Systems, Airborne Laser Swath Mapping Systems, Laser Altimetry Systems 偏振比: >100:1 光束质量因子(M2): < 1.1Photonics Industries的DX-355-20是一款波长为355 nm、功率为10至20 W、脉冲能量为0.4 MJ、工作温度为15至35摄氏度、存储温度为-10至40摄氏度的激光器。有关DX-355-20的更多详细信息,请联系我们。
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RGLX-532-2.5
功率: 2.5 W 应用: Cutting, drilling, welding, scribing, marking, micro-structuring, micro and meso-scale material processing, processing difficult materials, Satellite Laser Ranging (SLR), Laser Ranging Systems, Laser Guide Star Adaptive Optical Systems, Observatory Systems, Pump Probe Spectroscopy, TimeResolved Fluorescence Spectroscopy, Spectroscopy, Pumping OPO Systems, Ti:Sapphire Systems, Ultrafast Amplifier Systems 光束质量因子(M2): <1.3 横模: TEMoo来自Photonics Industries的RGLX-532-2.5是一种波长为532 nm、功率为2.5 W、脉冲能量为2.5 MJ、工作温度为15至30摄氏度的激光器。有关RGLX-532-2.5的更多详细信息,请联系我们。